Alternative EUVL resist processes for stochastic defect reduction

Julius Joseph Santillan; Masahiko Harumoto; Harold Stokes; Chisayo Mori; Yuji Tanaka; Tomohiro Motono; Masaya Asai; Toshiro Itani

doi:10.1117/12.2572771

14 October 2020 Alternative EUVL resist processes for stochastic defect reduction

Julius Joseph Santillan, Masahiko Harumoto, Harold Stokes, Chisayo Mori, Yuji Tanaka, Tomohiro Motono, Masaya Asai, Toshiro Itani

Author Affiliations +

Proceedings Volume 11517, Extreme Ultraviolet Lithography 2020; 1151718 (2020) https://doi.org/10.1117/12.2572771
Event: SPIE Photomask Technology + EUV Lithography, 2020, Online Only

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Abstract

Investigations on the application of aqueous ethyltrimethylammonium hydroxide (ETMAH) as an alternative developer solution for extreme ultraviolet lithography (EUVL) were carried out. Utilizing a widely-used chemically amplified resist, it was found that the ETMAH developer solution has no negative impact on lithographic performance; resolution, line width / line edge roughness, and sensitivity (compared to the de facto standard aqueous tetramethylammonium hydroxide or TMAH). Stochastic defectivity analysis was performed by considering the effect of line-break (in the overdose region) and line-bridge defects (in the underdose region), on exposure latitude (EL_X) and critical dimension or CD margin (CDM_X). Results show that the ETMAH improves EL_X and CDM_X by around 10% and 5%, respectively at a lower developer solution concentration of 0.20N. These results confirmed the capability of the ETMAH in reducing resist-based stochastic defects, demonstrating its potential as an alternative developer solution for EUVL.

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Julius Joseph Santillan, Masahiko Harumoto, Harold Stokes, Chisayo Mori, Yuji Tanaka, Tomohiro Motono, Masaya Asai, and Toshiro Itani "Alternative EUVL resist processes for stochastic defect reduction", Proc. SPIE 11517, Extreme Ultraviolet Lithography 2020, 1151718 (14 October 2020); https://doi.org/10.1117/12.2572771

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