Presentation
10 October 2020 Double-beam laser shockwave cleaning of nanoparticles on silicon wafers to eliminate uncleaned blind zone
Lisha S. Fan, Shuowen Zhang, Qingyu Yan, Jian Lin, Qunli Zhang, Jianhua Yao
Author Affiliations +
Abstract
A double-beam laser shockwave cleaning (DLSC) process is applied to clean nanoparticles on silicon wafer to eliminate the formation of uncleaned blind zone right under the plasma kernel. The size of the uncleaned blind zone in DLSC is reduced by 95% compared to the single-beam laser shockwave cleaning process. The study of the time-resolved plasma evolution suggests that the formation of multiple plasma kernels makes the nanoparticles in the blind zone exposed to the cleaning-effective zone of the nearby passing plasma. The theoretical calculation of the shockwave force distribution shows that the horizontal drag force from a nearby passing plasma in the DLSC process facilitates the nanoparticle removal in the blind zone.
Conference Presentation
© (2020) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Lisha S. Fan, Shuowen Zhang, Qingyu Yan, Jian Lin, Qunli Zhang, and Jianhua Yao "Double-beam laser shockwave cleaning of nanoparticles on silicon wafers to eliminate uncleaned blind zone", Proc. SPIE 11546, Advanced Laser Processing and Manufacturing IV, 115460H (10 October 2020); https://doi.org/10.1117/12.2575298
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KEYWORDS
Nanoparticles

Plasma

Semiconducting wafers

Semiconductor lasers

Silicon

Electronic components

Laser processing

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