Novel infrared focal plane array technology

Xingxin Liu; Chenggang Wang

doi:10.1117/12.2579461

5 November 2020 Novel infrared focal plane array technology

Xingxin Liu, Chenggang Wang

Proceedings Volume 11563, AOPC 2020: Infrared Device and Infrared Technology; 1156307 (2020) https://doi.org/10.1117/12.2579461
Event: Applied Optics and Photonics China (AOPC 2020), 2020, Beijing, China

Abstract

Innovations in optics, focal plane arrays (FPA), microelectronics and image processing have revolutionized infrared camera design. Infrared detectors coupled with nanostructures are expected to subvert the traditional intensity detectors and advance to the multi-dimensional and data cube detectors. Photon trapping technology is expected to decrease the intrinsic dark current, broaden the response band, increase the QE and increase the working temperature. High density FPAs result to novel wide field-of-view small SWaP broadband infrared camera architecture. Digital-pixel focal plane for real-time digital image processing enable the intelligent chips. This paper highlights sensors with nanostructure coupled FPA, photo trapping FPAs, high density FPAs and digital-pixel FPAs.

Citation Download Citation

Xingxin Liu and Chenggang Wang "Novel infrared focal plane array technology", Proc. SPIE 11563, AOPC 2020: Infrared Device and Infrared Technology, 1156307 (5 November 2020); https://doi.org/10.1117/12.2579461

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available