See-through imaging by HV-SEM: a simulation study

Benjamin D. Bunday

doi:10.1117/12.2584544

22 February 2021 See-through imaging by HV-SEM: a simulation study

Benjamin D. Bunday

Proceedings Volume 11611, Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV; 1161109 (2021) https://doi.org/10.1117/12.2584544
Event: SPIE Advanced Lithography, 2021, Online Only

Abstract

High Voltage SEM (HV-SEM) is now becoming more common in typical fab usage for achieving “see-through” overlay and detecting buried defects. To improve understanding of capabilities and limits, JMONSEL is used to simulate HV-SEM imaging of various buried test structures to explore how apparent resolution depends on incident beam energy, target and overlayer material, and overlayer material depth, thus improving understanding of HV-SEM’s limits in terms of what can be seen at what energy through how much overlayer, which is important for use case consideration and optimization.

Conference Presentation

Citation Download Citation

Benjamin D. Bunday "See-through imaging by HV-SEM: a simulation study", Proc. SPIE 11611, Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV, 1161109 (22 February 2021); https://doi.org/10.1117/12.2584544

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