High-speed wafer film measurement with heterogeneous optical sensor system

Doo-Hyun Cho; Seung Beom Park; Sung-Ha Kim; Taejoong Kim; Kwangsung Lee

doi:10.1117/12.2584200

22 February 2021 High-speed wafer film measurement with heterogeneous optical sensor system

Doo-Hyun Cho, Seung Beom Park, Sung-Ha Kim, Taejoong Kim, Kwangsung Lee

Proceedings Volume 11611, Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV; 116110H (2021) https://doi.org/10.1117/12.2584200
Event: SPIE Advanced Lithography, 2021, Online Only

Abstract

The inspection of thin-film thickness on a wafer is one of the key steps for the semiconductor manufacturing processes. This paper proposes estimating the film thickness profile of the wafer, where the 3-band RGB color imaging camera and the hyperspectral imaging module are utilized to achieve the robust metrology performance. The simulation results are designed for investigating the characteristics of estimated film thickness profiles based on the Gaussian process regression. We demonstrate this cost-effective solution is beneficial for monitoring the CMP process with small computational power. The proposed measurement method has a great potential to solve bottlenecks from the physical metrology processes.

Conference Presentation

Citation Download Citation

Doo-Hyun Cho, Seung Beom Park, Sung-Ha Kim, Taejoong Kim, and Kwangsung Lee "High-speed wafer film measurement with heterogeneous optical sensor system", Proc. SPIE 11611, Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV, 116110H (22 February 2021); https://doi.org/10.1117/12.2584200

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