Study of high throughput EUV mask pattern defect inspection technologies using multibeam electron optics

Hidekazu Takekoshi; Riki Ogawa; John G. Hartley; David J. Pinckeny; Atsushi Ando; Koichi Ishii; Chosaku Noda; Tadayuki Sugimori; Nobutaka Kikuiri

doi:10.1117/12.2583613

22 February 2021 Study of high throughput EUV mask pattern defect inspection technologies using multibeam electron optics

Hidekazu Takekoshi, Riki Ogawa, John G. Hartley, David J. Pinckeny, Atsushi Ando, Koichi Ishii, Chosaku Noda, Tadayuki Sugimori, Nobutaka Kikuiri

Author Affiliations +

Proceedings Volume 11611, Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV; 116112N (2021) https://doi.org/10.1117/12.2583613
Event: SPIE Advanced Lithography, 2021, Online Only

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Abstract

Using a POC tool, we are continuing a feasibility study for an EUV mask pattern inspection tool having multibeam electron optics with D2D and D2DB functions. In this paper, we will discuss our technologies in addition to our latest results on our POC tool.

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Hidekazu Takekoshi, Riki Ogawa, John G. Hartley, David J. Pinckeny, Atsushi Ando, Koichi Ishii, Chosaku Noda, Tadayuki Sugimori, and Nobutaka Kikuiri "Study of high throughput EUV mask pattern defect inspection technologies using multibeam electron optics", Proc. SPIE 11611, Metrology, Inspection, and Process Control for Semiconductor Manufacturing XXXV, 116112N (22 February 2021); https://doi.org/10.1117/12.2583613

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