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9 November 1989 Microelectromechanical Devices: An Overview
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Abstract
Recent advances in the technology of silicon micro-fabrication, building upon the fabrication technologies of microelectronics, have led to a capability for the fabrication of micromechanical components and devices that can be incorporated on a silicon chip, along with electronic components. Early products using this technology are already on the market. They use passive mechanical structures, such as diaphragms for pressure transducers or cantilever beams for accelerometers. During the summer of 1988, a rotating electrostatic micromotor was fabricated and operated, and it is now expected that sensors with active micromechanical components will be developed. This technology offers the possibility of fabricating complex mechanical systems at extremely low cost, and it could lead to a major new industry.
© (1989) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
George A. Hazelrigg "Microelectromechanical Devices: An Overview", Proc. SPIE 1167, Precision Engineering and Optomechanics, (9 November 1989); https://doi.org/10.1117/12.962933
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