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5 March 2021 Fast laser writing technique for laser assisted selective electroless copper deposition on dielectrics surface for in-mold electronics applications
Karolis Ratautas, Vytautas Vosylius, Ina Stankevičienė, Aldona Jagminienė, Eugenijus Norkus, Gediminas Račiukaitis
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Proceedings Volume 11673, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI; 116730Z (2021) https://doi.org/10.1117/12.2574913
Event: SPIE LASE, 2021, Online Only
Abstract
The selective surface activation induced by laser (SSAIL) for electroless copper deposition on PC-ABS blend is one of promoising technique of electric circuit formation on free-form dielectric surfaces, which broadens capabilities of 3D microscopic integrated devices (3D-MID). The process consists of laser excitation, chemical activation of laser-excited areas by dipping in a liquid and electroless copper deposition of laser-treated areas. The limiting factor to increase throughput of the technology is a laser activation step. Laser writing is performed by modern galvanometric scanners which reach the scanning speed of several meters per second. However, adverse thermal effects on PC-ABS polymer surface abridge the high-speed laser writing. In this work, an advantageous laser beam scanning technique by shifted pulse is used to overcome mentioned problems.
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Karolis Ratautas, Vytautas Vosylius, Ina Stankevičienė, Aldona Jagminienė, Eugenijus Norkus, and Gediminas Račiukaitis "Fast laser writing technique for laser assisted selective electroless copper deposition on dielectrics surface for in-mold electronics applications", Proc. SPIE 11673, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVI, 116730Z (5 March 2021); https://doi.org/10.1117/12.2574913
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KEYWORDS
Laser applications
Copper
Dielectrics
Electronics
Chemical lasers
Electroless plating
Laser processing
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