Presentation
5 March 2021 Fabrication of high crystalline AlN/sapphire for deep UV-LED
Hideto Miyake, Kenjiro Uesugi, Shiyu Xiao, Kanako Shojiki, Shigeyuki Kuboya
Author Affiliations +
Abstract
For the realization of highly efficient deep-ultraviolet light-emitting diodes (DUV-LEDs) based on III-nitride semiconductors, it is essential to improve the crystalline quality of the AlN templates for crystal growth of AlGaN. Our group has suggested sputtering deposition and post-deposition high-temperature face-to-face annealing (FFA) as a fabrication method of AlN films with low threading dislocation density (TDD) on sapphire substrates. Although the FFA enables reduction of TDDs, it possibly causes a cracking for AlN films due to a large thermal expansion coefficient mismatch between AlN and sapphire. In this work, we controlled the residual stress in AlN films by modifying the sputtering conditions. Consequently, we achieved crack-free AlN films with low TDDs.
Conference Presentation
© (2021) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hideto Miyake, Kenjiro Uesugi, Shiyu Xiao, Kanako Shojiki, and Shigeyuki Kuboya "Fabrication of high crystalline AlN/sapphire for deep UV-LED", Proc. SPIE 11686, Gallium Nitride Materials and Devices XVI, 116860Z (5 March 2021); https://doi.org/10.1117/12.2585271
Advertisement
Advertisement
Back to Top