Fast, robust, eye-safe, large working distance non-contact technology for ex-situ and in-situ stress, topography, wafer thickness, internal layer thickness metrology for semiconductor, MEMS, and precision manufacturing

Wojtek J. Walecki

doi:10.1117/12.2582602

5 March 2021 Fast, robust, eye-safe, large working distance non-contact technology for ex-situ and in-situ stress, topography, wafer thickness, internal layer thickness metrology for semiconductor, MEMS, and precision manufacturing

Wojtek J. Walecki

Author Affiliations +

Proceedings Volume 11700, Optical and Quantum Sensing and Precision Metrology; 1170045 (2021) https://doi.org/10.1117/12.2582602
Event: SPIE OPTO, 2021, Online Only

Abstract

I describe a novel apparatus for measurement of thickness and topography of slabs of materials employing probes with filters using polarization maintaining fibers.

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Wojtek J. Walecki "Fast, robust, eye-safe, large working distance non-contact technology for ex-situ and in-situ stress, topography, wafer thickness, internal layer thickness metrology for semiconductor, MEMS, and precision manufacturing", Proc. SPIE 11700, Optical and Quantum Sensing and Precision Metrology, 1170045 (5 March 2021); https://doi.org/10.1117/12.2582602

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