Translator Disclaimer
Presentation + Paper
5 March 2021 Fast, robust, eye-safe, large working distance non-contact technology for ex-situ and in-situ stress, topography, wafer thickness, internal layer thickness metrology for semiconductor, MEMS, and precision manufacturing
Author Affiliations +
Abstract
I describe a novel apparatus for measurement of thickness and topography of slabs of materials employing probes with filters using polarization maintaining fibers.
Conference Presentation
© (2021) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wojtek J. Walecki "Fast, robust, eye-safe, large working distance non-contact technology for ex-situ and in-situ stress, topography, wafer thickness, internal layer thickness metrology for semiconductor, MEMS, and precision manufacturing", Proc. SPIE 11700, Optical and Quantum Sensing and Precision Metrology, 1170045 (5 March 2021); https://doi.org/10.1117/12.2582602
PROCEEDINGS
13 PAGES + PRESENTATION

SHARE
Advertisement
Advertisement
Back to Top