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12 April 2021 T2SL focal planes for compact remote sensing instruments
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Abstract
In this presentation, we will report our recent efforts in achieving high performance in Antimonides type-II superlattice (T2SL) based infrared photodetectors using the barrier infrared detector (BIRD) architecture. The high operating temperature (HOT) BIRD focal plane arrays (FPAs) offer the same high performance, uniformity, operability, manufacturability, and affordability advantages as InSb. However, mid-wavelength infrared (MWIR) HOT-BIRD FPAs can operate at significantly higher temperatures (>150K) than InSb FPAs (typically 80K). Moreover, while InSb has a fixed cutoff wavelength (~5.4 μm), the HOT-BIRD offers a continuous adjustable cutoff wavelength, ranging from ~4 μm to >15 μm, and is therefore also suitable for long wavelength infrared (LWIR) as well. The LWIR detectors based on the BIRD architecture has also demonstrated significant operating temperature advantages over those based on traditional p-n junction designs. Two 6U SmalSat missions CIRAS (Cubesat Infrared Atmospheric Sounder) and HyTI (Hyperspectral Thermal Imager) are based on JPL’s T2SL BIRD focal plane arrays (FPAs). Based on III-V compound semiconductors, the BIRD FPAs offer a breakthrough solution for the realization of low cost (high yield), high-performance FPAs with excellent uniformity and pixel-to-pixel operability. We have also exploring the possibilities of implementing either metasurface resonator cavity or metasurface based flatlens to improve the signal-to-noise ratio of the detectors.
Conference Presentation
© (2021) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sarath Gunapala, David Ting, Sir Rafol, Alexander Soibel, Arezou Khoshakhlagh, Sam Keo, Brian Pepper, Anita Fisher, Cory Hill, Tobias Wenger, Thomas Pagano, Kwong-Kit Choi, Paul Lucey, Robert Wright, Miguel Nunes, Luke Flynn, Sachidananda Babu, and Parminder Ghuman "T2SL focal planes for compact remote sensing instruments", Proc. SPIE 11723, Image Sensing Technologies: Materials, Devices, Systems, and Applications VIII, 1172302 (12 April 2021); https://doi.org/10.1117/12.2595798
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