Translator Disclaimer
Open Access Presentation
11 March 2021 Multi-beam processing as a method for efficient micromachining with pico second mJ level laser systems
Author Affiliations +
Abstract
When applying picosecond laser pulses of the order of several mJ pulse energy, the goal is to deliver the pulses effectively to the surface. HiLASE have development novel diode pumped thin-disk laser systems which are used for high speed drilling (700 holes simultaneously) and high speed surface structuring (several cm2 per second). Different methods of multi-beam processing will be presented.
Conference Presentation
© (2021) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Danijela Rostohar "Multi-beam processing as a method for efficient micromachining with pico second mJ level laser systems", Proc. SPIE 11768, SPIE Photonics West Industry Events, 117680K (11 March 2021); https://doi.org/10.1117/12.2593540
PROCEEDINGS
PRESENTATION


SHARE
Advertisement
Advertisement
Back to Top