Influence of chemical-mechanical polishing on the surface roughness of microchannel plate

Hua Cai; Jing Ma; Hui Liu; Yin Wu; Shuaiqi Li; Chang Liu; Chen Wang; Tiezhu Bo; Shiyong Xie; Caili Wang; Kaiyu Li

doi:10.1117/12.2627228

27 March 2022 Influence of chemical-mechanical polishing on the surface roughness of microchannel plate

Hua Cai, Jing Ma, Hui Liu, Yin Wu, Shuaiqi Li, Chang Liu, Chen Wang, Tiezhu Bo, Shiyong Xie, Caili Wang, Kaiyu Li

Proceedings Volume 12169, Eighth Symposium on Novel Photoelectronic Detection Technology and Applications; 12169CE (2022) https://doi.org/10.1117/12.2627228
Event: Eighth Symposium on Novel Photoelectronic Detection Technology and Applications, 2021, Kunming, China

Abstract

Microchannel plate (MCP) is an important charged-particle electronic multiplier, whose surface roughness is one of the vital factors of high-performance multiplication. A chemical-mechanical polishing (CMP) is a planarization process assisted by chemical reactions to remove surface materials and improve surface smoothness. In this paper, atomic force microscopy (AFM) was applied to investigate the surface roughness of the MCP wafers by chemical-mechanical polishing. After chemical-mechanical polishing, the global surface roughness increased from 8.33 nm into 9.01 nm, which was contrary to the conventional chemical-mechanical polishing results. Using the surface partitioning analysis, we confirmed that the escalated global surface roughness was related to the raised surface roughness of the acid-soluble core glass (from 2.35 nm rise to 3.07 nm after CMP), which occupied more than 60% area of the MCP wafer. Moreover, the surface roughness of the etching-resistance cladding glass was notably dropped after CMP (from 6.48 nm decreased to 4.84 nm). Thus, CMP was a benefit to improve the surface finishing of the MCP multiplier despite the global surface roughness increasing after that.

Citation Download Citation

Hua Cai, Jing Ma, Hui Liu, Yin Wu, Shuaiqi Li, Chang Liu, Chen Wang, Tiezhu Bo, Shiyong Xie, Caili Wang, and Kaiyu Li "Influence of chemical-mechanical polishing on the surface roughness of microchannel plate", Proc. SPIE 12169, Eighth Symposium on Novel Photoelectronic Detection Technology and Applications, 12169CE (27 March 2022); https://doi.org/10.1117/12.2627228

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available