Cone-beam computed laminography for flexible three-dimensional analysis of stacked microvias in multilayer printed circuit boards

Cale E. Lewis; Neil A. Ives; Gary W. Stupian

doi:10.1117/12.2628973

14 October 2022 Cone-beam computed laminography for flexible three-dimensional analysis of stacked microvias in multilayer printed circuit boards

Cale E. Lewis, Neil A. Ives, Gary W. Stupian

Author Affiliations +

Proceedings Volume 12242, Developments in X-Ray Tomography XIV; 122421D (2022) https://doi.org/10.1117/12.2628973
Event: SPIE Optical Engineering + Applications, 2022, San Diego, California, United States

Abstract

While conventional computed tomography (CT) is widely used in nondestructive analysis applications, the scanning geometry poses limitations on objects with high aspect ratios, such as printed circuit boards (PCBs), which significantly reduce image quality. Alternatively, computed laminography (CL) techniques are being developed to overcome these challenges by granting additional flexibility of the scan geometry. For this study, the capabilities of a laboratory cabinet x-ray system are extended to perform CL scan acquisitions. Key issues regarding the system geometry are evaluated and calibration techniques are implemented to ensure CL reconstruction accuracy, which is particularly sensitive for high-magnification applications. Results using the CL method are evaluated against the traditional cone-beam CT method which shows improved image quality for the nondestructive inspection of stacked microvias buried within large PCBs. This study also uncovers the particular issues with our system geometry calibration that influence the quality of the reconstructed CL images. Application of these results suggest that cone-beam CL is an effective alternative to conventional CT when inspecting fine features within high aspect ratio objects.

Conference Presentation

Citation Download Citation

Cale E. Lewis, Neil A. Ives, and Gary W. Stupian "Cone-beam computed laminography for flexible three-dimensional analysis of stacked microvias in multilayer printed circuit boards", Proc. SPIE 12242, Developments in X-Ray Tomography XIV, 122421D (14 October 2022); https://doi.org/10.1117/12.2628973

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