Paper
1 June 1990 Negative tone aqueous developable resist for photon, electron, and x-ray lithography
Will Conley, Wayne M. Moreau, Stanley Perreault, Gary T. Spinillo, Robert L. Wood, Jeffrey D. Gelorme, Ronald M. Martino
Author Affiliations +
Abstract
The use of negative acting photoresists has become a integral part of device fabrication strategy. In this paper we will. discuss a phenolic based photoresist which incorporates a crosslinkable resin and an acid generating sensitizer. When exposed and thermally treated, the resist forms a negative tone image which is developable in an alkaline medium. We will discuss the materials, processes and results from photon, electron and X-ray lithographic evaluations.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Will Conley, Wayne M. Moreau, Stanley Perreault, Gary T. Spinillo, Robert L. Wood, Jeffrey D. Gelorme, and Ronald M. Martino "Negative tone aqueous developable resist for photon, electron, and x-ray lithography", Proc. SPIE 1262, Advances in Resist Technology and Processing VII, (1 June 1990); https://doi.org/10.1117/12.20087
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CITATIONS
Cited by 5 scholarly publications and 1 patent.
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KEYWORDS
Semiconducting wafers

Photoresist materials

X-ray lithography

Lithography

Electron beams

X-rays

Photomasks

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