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7 August 2023 Nanoimprint-based pattern transfer to 300 mm substrates
Matthew Traub, Myriam Willegms, Sundararajan Thirumalai, Steve Smout, Mohamed Asbahi, Bogumila Kutrzeba-Kotowska, Silvia Lenci, Eleonora Storace
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Proceedings Volume 12624, Digital Optical Technologies 2023; 126240E (2023) https://doi.org/10.1117/12.2675915
Event: SPIE Digital Optical Technologies, 2023, Munich, Germany
Abstract
As flat optics become increasingly mainstream, there is high interest in improving patterning resolution, making new materials available, and lowering manufacturing costs for these components. Because of their maturity across the entire supply chain, 300 mm m offer one of the best opportunities to simultaneously achieve all of these goals. By leveraging existing tooling and knowledge from 300 mm CMOS patterning, the high-pattern resolution of immersion DUV mastering can be combined with nanoimprint lithography and etching to achieve pattern transfer to optical materials. Wafer scale CMOS metrology can also be leveraged to optimize process uniformity and repeatability. This talk will present imec’s recent developments in utilizing CMOS fab tools to pattern high-index dielectrics on 300 mm substrates.
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© (2023) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
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Matthew Traub, Myriam Willegms, Sundararajan Thirumalai, Steve Smout, Mohamed Asbahi, Bogumila Kutrzeba-Kotowska, Silvia Lenci, and Eleonora Storace "Nanoimprint-based pattern transfer to 300 mm substrates", Proc. SPIE 12624, Digital Optical Technologies 2023, 126240E (7 August 2023); https://doi.org/10.1117/12.2675915
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KEYWORDS
Optical lithography
Deep ultraviolet
Dielectrics
Etching
Flat optics
Manufacturing
Metrology
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