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16 June 2023 Structural design of electronic equipment with frameless construction and blind mating connection
Qifeng Yin, Li Shen, Xiaojie Fan, Shangkun Zhu
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Proceedings Volume 12639, Third International Conference on Mechanical Design and Simulation (MDS 2023); 126390J (2023) https://doi.org/10.1117/12.2682009
Event: Third International Conference on Mechanical Design and Simulation (MDS 2023), 2023, Xi'an, China
Abstract
With the continuous improvement of the functional performance demand of complex electronic equipment, the electronics on board are becoming more and more integrated. Traditional structure designs are becoming increasingly difficult to meet the requirements with harsh weight index. In this paper, a lightweight space-borne electronic device with blind insertion structure is designed. The conventional chassis frame structure is abandoned. By connecting to the backplane through blind connectors, the type and number of cable connections inside the electronic equipment are greatly reduced. It solves the main contradiction of equipment volume, weight and heat dissipation. The mechanical characteristics and thermal analysis of electronic equipment structure are carried out by finite element method. The corresponding structural deformation and stress distributions are obtained. The results show that, the electronic equipment meets the requirements of structural stiffness and thermal design. The structural design is reliable and safe.
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Qifeng Yin, Li Shen, Xiaojie Fan, and Shangkun Zhu "Structural design of electronic equipment with frameless construction and blind mating connection", Proc. SPIE 12639, Third International Conference on Mechanical Design and Simulation (MDS 2023), 126390J (16 June 2023); https://doi.org/10.1117/12.2682009
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KEYWORDS
Structural design
Vibration
Connectors
Modal analysis
Satellites
Electronic components
Finite element methods
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