3D SEM metrology of microstructures for high volume manufacturing

Zeinab Abdallah; Aurélien Fay; Stéphane Bonnet

doi:10.1117/12.2675620

5 October 2023 3D SEM metrology of microstructures for high volume manufacturing

Zeinab Abdallah, Aurélien Fay, Stéphane Bonnet

Proceedings Volume 12802, 38th European Mask and Lithography Conference (EMLC 2023); 128020N (2023) https://doi.org/10.1117/12.2675620
Event: 38th European Mask and Lithography Conference, 2023, Dresden, Germany

Abstract

Scanning Electron Microscopy (SEM) uses surface-emitted Secondary Electrons (SE) to produce grayscale level images. From these SEM images, an observer can mentally represent the topography of the imaged object. Numerical techniques can additionally provide a quantitative assessment of the topography, which is one of the major challenge in the today microelectronics industry for advanced nodes and more-than-moore devices. In this paper, we propose and validate a non-destructive, fast 3D metrology strategy for microscopic object. Various microlens-like 3D structures are patterned on 300 nm wafers by grayscale i-line lithography. The lenses are imaged by a SEM tool with a four-quadrant SE detector, and also measured by Atomic Force Microscopy (AFM) which serves as 3D reference metrology. Both, AFM and SEM data are co-registered and background is removed. An analytical SEM model is used both for SEM detector calibration and parametric reconstruction. First, we observe that this model poorly describes the entire SEM images of the device under test, partly due to electron screening and reemission effects. Secondly, by weighting the image depending on the quadrant orientation, we show that this model can still be used for both calibration and parametric reconstruction. The parametric reconstructions of microlenses with different footprints and heights match well the reference geometries.

Citation Download Citation

Zeinab Abdallah, Aurélien Fay, and Stéphane Bonnet "3D SEM metrology of microstructures for high volume manufacturing", Proc. SPIE 12802, 38th European Mask and Lithography Conference (EMLC 2023), 128020N (5 October 2023); https://doi.org/10.1117/12.2675620

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KEYWORDS

Scanning electron microscopy

Microlens

3D modeling

Calibration

Image restoration

Analytic models

Atomic force microscopy

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