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The manufacture of reticles for the Ultratech Model 900 IX wafer stepper presents the greatest challenge in mask-making. Each finished reticle must meet the strictest standards and specifications in defect density, critical dimension control and registration and overlay accuracy. The IX reticle places great demands on the ability of the mask maker to produce fine line lithography, typically 1.5 microns and smaller, with no defects larger than 0.5 microns. The effect of these manufacturing requirements on the inspection process is reviewed in this paper. What is the best manufacturing flow to assure economical use of very expensive capital equipment needed to inspect and qualify this product? Decision criteria for resolving these issues are set forth.
Larry Zurbrick andGeorge Brooks
"Inspection strategies for 1x reticles", Proc. SPIE 12809, Bay Area Chrome Users Society Symposium 1985, 128090N (12 October 2023); https://doi.org/10.1117/12.3011909
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Larry Zurbrick, George Brooks, "Inspection strategies for 1x reticles," Proc. SPIE 12809, Bay Area Chrome Users Society Symposium 1985, 128090N (12 October 2023); https://doi.org/10.1117/12.3011909