THz-TDS for IC packaging material changes detection under real-world conditions

Chengjie Xi; Nitin Varshney; Mohammad Shafkat M. Khan; Hamed Dalir; Navid Asadizanjani

doi:10.1117/12.3004241

11 March 2024 THz-TDS for IC packaging material changes detection under real-world conditions

Chengjie Xi, Nitin Varshney, Mohammad Shafkat M. Khan, Hamed Dalir, Navid Asadizanjani

Proceedings Volume 12885, Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications XVII; 128850B (2024) https://doi.org/10.1117/12.3004241
Event: SPIE OPTO, 2024, San Francisco, California, United States

Abstract

Hardware security has been a significant challenge in semiconductor devices, leading to serious issues such as denial of service, data leakage etc at both transistor as well as package level. Detecting the usage state of a target semiconductor sample or generating a unique fingerprint can provide critical information about the sample, aiding in the prevention of counterfeiting to avoid hardware security risks. Terahertz Time-Domain Spectroscopy (THz-TDS) stands out as a powerful and non-destructive tool, capable of probing and analyzing the polymer materials. Its sensitivity to molecular-level changes makes THz-TDS suitable for studying the material, structural, and stress properties of IC packaging under real-world conditions. This research begins by reviewing the composition of Electronic Material Compatibility (EMC) materials and their variance under real-world conditions. Furthermore, the application of THz-TDS for polymer material characterization, which incloudes material, structural, and internal stress characterization, is also thoroughly reviewed. By combining these factors, we explore the potential and capability of using THz-TDS to detect real-world loaded samples and the feasibility of generating fingerprints for identifying counterfeit samples, including reused, recycled, or tampered ones.

Conference Presentation

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Chengjie Xi, Nitin Varshney, Mohammad Shafkat M. Khan, Hamed Dalir, and Navid Asadizanjani "THz-TDS for IC packaging material changes detection under real-world conditions", Proc. SPIE 12885, Terahertz, RF, Millimeter, and Submillimeter-Wave Technology and Applications XVII, 128850B (11 March 2024); https://doi.org/10.1117/12.3004241

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