Militarized, laser-welded optoelectronic device packaging

Gary Nelson; Roger W. Honebrink; Dennis D. Long; Mark L. Wilson

doi:10.1117/12.21001

1 October 1990 Militarized, laser-welded optoelectronic device packaging

Gary Nelson, Roger W. Honebrink, Dennis D. Long, Mark L. Wilson

Proceedings Volume 1291, Optical and Digital Gallium Arsenide Technologies for Signal Processing Applications; (1990) https://doi.org/10.1117/12.21001
Event: 1990 Technical Symposium on Optics, Electro-Optics, and Sensors, 1990, Orlando, FL, United States

Abstract

A technique is described for packaging commercial lasers, ELEDs, and detectors for military environments with a wide range of temperatures. Laser welding and gradient-index lenses are combined in the packaging design, and stable coupling efficiency is achieved by utilizing both pigtailed single-mode fiber packages and SMA connectorized multimode fiber packages. The coupling efficiency is demonstrated to be high, and packages are described which are suitable for commercial devices with diameters of 9 and 5.6 mm.

Citation Download Citation

Gary Nelson, Roger W. Honebrink, Dennis D. Long, and Mark L. Wilson "Militarized, laser-welded optoelectronic device packaging", Proc. SPIE 1291, Optical and Digital Gallium Arsenide Technologies for Signal Processing Applications, (1 October 1990); https://doi.org/10.1117/12.21001

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