Presentation + Paper
10 April 2024 The next step in Moore’s law: high-NA EUV introduction at the customer
J. G. Santaclara, Rudy Peeters, Rob van Ballegoij, Sjoerd Lok, Jan van Schoot, Paul Graeupner, Peter Kuerz, Joerg Mallmann, Greet Storms, Peter Vanoppen
Author Affiliations +
Abstract
To enable cost-effective scaling of technology nodes and extend Moore’s law for at least another decade, ASML has developed the High NA EUV platform. With an increase of the numerical aperture (NA) from 0.33NA to 0.55NA, High NA EUV brings multiple benefits to the semiconductor market, such as reduction of process complexity, yield improvement and higher resolution. This paper presents the High NA EUV ASML roadmap, providing a comprehensive overview of the systems being developed to support our customers’ nodes, and showing how we maximize 0.33NA (NXE) and 0.55 NA (EXE) platforms commonality, making High NA an evolutionary step on EUV technology. We will also give an overview of the progress and status of the first High NA EUV platform, the EXE:5000. Several systems have been now fully built in the ASML factory, which deliver the first performance data and integration learnings to support shipment to our customers. In parallel, first common learnings from the imec - ASML joint High NA Lab will be reported out, enabling early process development and accelerating the industry eco-system (mask, resist), as it is essential to the successful introduction of High NA EUV.
Conference Presentation
© (2024) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. G. Santaclara, Rudy Peeters, Rob van Ballegoij, Sjoerd Lok, Jan van Schoot, Paul Graeupner, Peter Kuerz, Joerg Mallmann, Greet Storms, and Peter Vanoppen "The next step in Moore’s law: high-NA EUV introduction at the customer", Proc. SPIE 12953, Optical and EUV Nanolithography XXXVII, 129530P (10 April 2024); https://doi.org/10.1117/12.3009070
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KEYWORDS
Extreme ultraviolet

Semiconducting wafers

System integration

Image sensors

Reticles

Ecosystems

Lithography

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