Demonstration of a micro-hotplate chip with a good temperature uniformity

Xin Tian; Jifang Tao; Jia Zhao

doi:10.1117/12.3024989

28 March 2024 Demonstration of a micro-hotplate chip with a good temperature uniformity

Xin Tian, Jifang Tao, Jia Zhao

Proceedings Volume 13091, Fifteenth International Conference on Signal Processing Systems (ICSPS 2023); 130912J (2024) https://doi.org/10.1117/12.3024989
Event: Fifteenth International Conference on Signal Processing Systems (ICSPS 2023), 2023, Xi’an, China

Abstract

The gas sensor based on Micro-electromechanical system (MEMS) technology has the advantages of high sensitivity, small size, good batch uniformity and low power consumption. It has become an important development direction of the next-generation semiconductor gas sensor. This paper focuses on the design of the micro-hotplate chip for MEMS gas sensors. A type of micro-hotplate chip design with an isothermal hot area (±15 K) accounting for 90% is demonstrated through both the thermal theory analysis and the finite element simulation of the physical field, effectively resolving the issue of broad area uniform heating in the micro-sized chip in MEMS gas sensor designs. The infrared thermal image test results show the temperature of four points from edge to center of heating area are 295.5 °C, 287.5 °C, 289 °C, 294.8 °C respectively, which indicates the heat uniformity of micro-hotplate. Due to the limitation of a low temperature film deposition process, the maximum stress of the micro-hotplate films is about 1500 MPa, and at 375 °C operating temperature, the power consumption per area is only 4.5×10-4 mW/μm².

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Xin Tian, Jifang Tao, and Jia Zhao "Demonstration of a micro-hotplate chip with a good temperature uniformity", Proc. SPIE 13091, Fifteenth International Conference on Signal Processing Systems (ICSPS 2023), 130912J (28 March 2024); https://doi.org/10.1117/12.3024989

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