Fault location in printed wiring boards using thermal imaging

Fremont Reizman

doi:10.1117/12.34728

1 March 1990 Fault location in printed wiring boards using thermal imaging

Fremont Reizman

Proceedings Volume 1313, Thermosense XII: An International Conference on Thermal Sensing and Imaging Diagnostic Applications; (1990) https://doi.org/10.1117/12.34728
Event: 1990 Technical Symposium on Optics, Electro-Optics, and Sensors, 1990, Orlando, FL, United States

Abstract

A case history is presented in which infrared imaging is used to locate shorts in a complex printed wiring board. Passing current through the short heats the conductor trace, and the current path is delineated on the IR image. This method is shown to be useful for a variety of current-carrying structures, both for failure analysis and reverse engineering. It can often be used with very limited knowledge of the detailed function of the device.

Citation Download Citation

Fremont Reizman "Fault location in printed wiring boards using thermal imaging", Proc. SPIE 1313, Thermosense XII: An International Conference on Thermal Sensing and Imaging Diagnostic Applications, (1 March 1990); https://doi.org/10.1117/12.34728

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