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Conference CommitteeSymposium Chair Symposium Vice Chair Advisory Committee Chair Advisory Committee Members Masato Shibuya, Tokyo Polytechnic University (Japan) Yoshio Tanaka, D2S, Inc. (Japan) Kazuyuki Suko, Dai Nippon Printing Company, Ltd. (Japan) Naoya Hayashi, Honorary Fellow, Dai Nippon Printing Company, Ltd. (Japan) Morihisa Hoga, NAMTEC Company, Ltd. (Japan) Toshiyuki Horiuchi, Tokyo Denki University (Japan) Nobuyuki Yoshioka, Dai Nippon Printing Company, Ltd. (Japan)
Organizing Committee Chair Organizing Committee Vice Chair Organizing Committee Members Soichi Inoue, Kioxia Corporation (Japan) Yasunori Ogawa, Dai Nippon Printing Company, Ltd. (Japan) Kokoro Kato, Synopsys, Inc. (Japan) Keita Shogase, SEMI Japan (Japan) Hiroshi Nakata, Dai Nippon Printing Company, Ltd. (Japan) Noriaki Nakayamada, NuFlare Technology, Inc. (Japan) Masahiro Hashimoto, HOYA Corporation (Japan) Hideaki Hamada, HTL Co. Japan Ltd. (Japan) Keisuke Morinaka, Sony Semiconductor Manufacturing Corporation (Japan) Kiyohito Yamamoto, Canon Inc. (Japan) Uwe Behringer, UBC Microelectronics (Germany) Brian Grenon, Grenon Consulting, Inc. (United States) Warren Montgomery, EMD Electronics (United States) Jed Rankin, IBM Research (United States)
Organizing Committee Auditors Fumio Aramaki, Hitachi High-Tech Corporation (Japan) Yoji Tonooka, Toppan Inc. (Japan)
Program Committee Chair Program Committee Vice Chairs Yusuke Kawano, Renesas Electronics Corporation (Japan) Noriaki Nakayamada, NuFlare Technology, Inc. (Japan) Tetsuo Harada, University of Hyogo (Japan)
Program Committee Members Akihiko Ando, Kioxia Corporation (Japan) Shingo Ishida, Canon Inc. (Japan) Nobuhisa Imashiki, HOYA Corporation (Japan) Nobuhiro Okai, Hitachi, Ltd. (Japan) Kokoro Kato, Synopsys, Inc. (Japan) Daisuke Kenmochi, HOYA Corporation (Japan) Kenji Go, Mycronic Technologies Corporation (Japan) Yosuke Kojima, Toppan Photomask Company, Ltd. (Japan) Masaaki Koyama, Sony Semiconductor Manufacturing Corporation (Japan) Kazunori Seki, Toppan Photomask Company, Ltd. (Japan) Yasunari Sohda, University of Tsukuba (Japan) Yasuko Tabata, Tower Partners Semiconductor Company, Ltd. (Japan) Yoshihiro Tezuka, Intel Corporation (Japan) Takaharu Nagai, Dai Nippon Printing Company, Ltd. (Japan) Sanehiko Hoshi, D2S, Inc. (Japan) Hiroyuki Miyashita, Dai Nippon Printing Company, Ltd. (Japan) Takashi Yagami, Nikon Corporation (Japan) Tetsuro Wakatsuki, JEOL Ltd. (Japan) Jin Choi, Samsung Electronics Company, Ltd. (Korea, Republic of) Thomas Faure, GlobalFoundries Inc. (United States) Thiago Figueiro, Applied Materials, Inc. (United States) Bryan Kasprowicz, HOYA Corporation (United States) Byung-Gook Kim, ESOL, Inc (Korea, Republic of) Dong-Seok Nam, ASML US (United States) Thomas Scheruebl, ZEISS SMT GmbH (Germany) Guojing Zhang, Intel Corporation (United States)
Steering Committee Chair Steering Committee Vice Chairs Soichi Inoue, Kioxia Corporation (Japan) Kenji Go, Mycronic Technologies Corporation (Japan)
Steering Committee Members Yumiko Amano, Renesas Electronics Corporation (Japan) Akihiko Ando, Kioxia Corporation (Japan) Yusuke Kawano, Renesas Electronics Corporation (Japan) Hirofumi Kozakai, HOYA Corporation (Japan) Toshio Konishi, Toppan Photomask Company, Ltd. (Japan) Masaaki Koyama, Sony Semiconductor Manufacturing Corporation (Japan) Yasuko Saito, ASML Japan Company, Ltd. (Japan) Kiwamu Takehisa, Lasertec Corporation (Japan) Hiroshi Nakata, Dai Nippon Printing Company, Ltd. (Japan) Noriaki Nakayamada, NuFlare Technology, Inc. (Japan) Tetsuo Harada, University of Hyogo (Japan) Koji Hosono, United Semiconductor Japan Company, Ltd. (Japan) Yasutaka Morikawa, Dai Nippon Printing Company, Ltd. (Japan) Masahiko Yasuda, Nikon Corporation (Japan) Yuji Watanabe, JEOL Ltd. (Japan) James Wiley, Geminatio, Inc. (United States)
Session Chairs Opening Session Day 1/Keynote & EUV Blank Technology Hiroshi Nakata, Dai Nippon Printing Company, Ltd. (Japan) Bryan Kasprowicz, HOYA Corporation (United States) FPD Related & Matured Technologies Kenji Go, Mycronic Technologies Corporation (Japan) Daisuke Kenmochi, HOYA Corporation (Japan) Special Session Chiplet & Heterogeneous Hiroshi Nakata, Dai Nippon Printing Company, Ltd. (Japan) Dong-Seok Nam, ASML US (United States) NIL Akihiko Ando, Kioxia Corporation (Japan) Takaharu Nagai, Dai Nippon Printing Company, Ltd. Japan) Computational Solutions for Writing/Metrology Kokoro Kato, Synopsys, Inc. (Japan) Thiago Figueiro, Applied Materials, Inc. (United States) Lithography Related Technologies Yusuke Kawano, Renesas Electronics Corporation (Japan) Kokoro Kato, Synopsys, Inc. (Japan) Opening Session Day 2/Keynote & Stitching Yosuke Kojima, Toppan Photomask Company, Ltd. (Japan) Yoshihiro Tezuka, Intel Corporation (Japan) Mask Process Technologies Noriaki Nakayamada, NuFlare Technology, Inc. (Japan) Safak Sayan, Intel Corporation (United States) Energy Sustainability in Lithography Masaaki Koyama, Sony Semiconductor Manufacturing Corporation (Japan) Thomas Scheruebl, ZEISS Semiconductor Mask Solutions (Germany) Opening Session Day3/EUV Process Technologies Tetsuo Harada, University of Hyogo (Japan) Jo Finders, ASML Netherlands (Netherlands) Actinic Inspection Kazunori Seki, Toppan Photomask Company, Ltd. (Japan) Byung Gook Kim, ESOL, Inc (Korea, Republic of) Actinic Tools Kazunori Seki, Toppan Photomask Company, Ltd. (Japan) Byung Gook Kim, ESOL, Inc (Korea, Republic of) Repair and Metrology Nobuhiro Okai, Hitachi, Ltd. (Japan) Leo Pang, D2S, Inc. (United States) Writing Tools and Patterning Technologies Tetsuro Wakatsuki, JEOL Ltd. (Japan) Ingo Bork, Siemens Industry Software Inc. (United States)
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