Next generation reticle substrate for EUV lithography

Michael Campion; Ali Mohammadkhah; Carlos Durán; John Maxon

doi:10.1117/12.3048611

13 November 2024 Next generation reticle substrate for EUV lithography

Michael Campion, Ali Mohammadkhah, Carlos Durán, John Maxon

Proceedings Volume 13216, Photomask Technology 2024; 1321609 (2024) https://doi.org/10.1117/12.3048611
Event: SPIE Photomask Technology + EUV Lithography, 2024, Monterey, California, United States

Abstract

Corning has long produced, ULE® (Ultra Low Expansion) glass, which has become the Low Thermal Expansion Material (LTEM) of choice for EUV reticle substrates. Despite continuous improvements, the direct-to-glass process faces challenges in reducing overall thermal expansion uniformity as well as producing striations. In this paper, we present a step change in EUV reticle substrate performance. This new process utilizes an innovative glass forming technique resulting in glass with superior uniformity that avoids the formation of striae, while maintaining the same high purity of current ULE® glass, without any modifications to its physical or chemical properties.

Conference Presentation

Citation Download Citation

Michael Campion, Ali Mohammadkhah, Carlos Durán, and John Maxon "Next generation reticle substrate for EUV lithography", Proc. SPIE 13216, Photomask Technology 2024, 1321609 (13 November 2024); https://doi.org/10.1117/12.3048611

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