Packaging of electronics for on- and off-FPA signal processing

Stuart N. Shanken

doi:10.1117/12.23018

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1 November 1990 Packaging of electronics for on- and off-FPA signal processing

Stuart N. Shanken

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Proceedings Volume 1339, Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array Technology II; (1990) https://doi.org/10.1117/12.23018
Event: 34th Annual International Technical Symposium on Optical and Optoelectronic Applied Science and Engineering, 1990, San Diego, CA, United States

Abstract

The process for manufacturing parallel processors using Z-plane technology is described along with the interconnectivity achievable for parallel processors. A thermal analysis performed on a typical module using the NASA SINDA model is shown. The Z-plane packaging technology producibility and reworkability are addressed.

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Stuart N. Shanken "Packaging of electronics for on- and off-FPA signal processing", Proc. SPIE 1339, Materials, Devices, Techniques, and Applications for Z-Plane Focal Plane Array Technology II, (1 November 1990); https://doi.org/10.1117/12.23018

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