You have requested a machine translation of selected content from our databases. This functionality is provided solely for your convenience and is in no way intended to replace human translation. Neither SPIE nor the owners and publishers of the content make, and they explicitly disclaim, any express or implied representations or warranties of any kind, including, without limitation, representations and warranties as to the functionality of the translation feature or the accuracy or completeness of the translations.
Translations are not retained in our system. Your use of this feature and the translations is subject to all use restrictions contained in the Terms and Conditions of Use of the SPIE website.
1 February 1991XUV resist characterization: studies with a laser plasma source
A monochromatized laser-produced plasma source of XUV radiation has been used to study resists for use
in projection x-ray lithography. We report the characterization of exposure sensitivity and contrast of
poly(cyclohexylmethyl-co-trimethylsilylmethylsilane) (CMTMS) at photon energies near 100 eV, where
projection x-ray lithography is being developed. Using monochromatized XUV exposures on the Si-Si a
resonance at 105 eV, followed by solvent dissolution development, the polysilane yields positive tone,
exhibiting a sensitivity of 600 mJ/cm2 to achieve a saturation depth of 0.17 p.m and a contrast of 1.4.
Beyond this saturation dose, the tone is observed to reverse (i.e. greater doses yield smaller developed
depths). Exposure sensitivity measurements have also been performed below the edge at 92 eV where we
find only minor differences in contrast and saturation dose from the results at 105 eV. These can be
accounted for by a simple decrease in film absorption. The exposure sensitivities of selected
commercially-available electron beam resists have also been characterized. Two PMMA resists (M =74
K and 500 K) and the novolac-based SYSThM-9 (Shipley Co.) have been exposed to monochromatized
radiation at 140 A. PMMA exhibits a sensitivity of 600 mJ/cm2 (0.58 m developed depth) and a contrast
of 1.8 while the SYSTEMTh-9 resist requires only 22 mJ/cm2 (0.43 j.tm depth) and exhibits a contrast of
4. 1.
Glenn D. Kubiak
"XUV resist characterization: studies with a laser plasma source", Proc. SPIE 1343, X-Ray/EUV Optics for Astronomy, Microscopy, Polarimetry, and Projection Lithography, (1 February 1991); https://doi.org/10.1117/12.23201
The alert did not successfully save. Please try again later.
Glenn D. Kubiak, "XUV resist characterization: studies with a laser plasma source," Proc. SPIE 1343, X-Ray/EUV Optics for Astronomy, Microscopy, Polarimetry, and Projection Lithography, (1 February 1991); https://doi.org/10.1117/12.23201