Fast, epoxiless bonding system for fiber optic connectors

Nicholas A. Lee

doi:10.1117/12.24675

1 January 1991 Fast, epoxiless bonding system for fiber optic connectors

Nicholas A. Lee

Proceedings Volume 1365, Components for Fiber Optic Applications V; (1991) https://doi.org/10.1117/12.24675
Event: SPIE Microelectronic Interconnect and Integrated Processing Symposium, 1990, San Jose, United States

Abstract

The epoxy adhesives traditionally used to bond optical fibers into connectors complicate the connector assembly process due to their limitations in shelf life pot life ease of application and cure time. 3M has developed a new high performance hotmelt adhesive fiber bonding system which overcomes the limitations of the epoxies while providing additional benefits in ease of use and reduced installed cost.

Citation Download Citation

Nicholas A. Lee "Fast, epoxiless bonding system for fiber optic connectors", Proc. SPIE 1365, Components for Fiber Optic Applications V, (1 January 1991); https://doi.org/10.1117/12.24675

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