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1 February 1991 Optical interconnects: a solution to very high speed integrated circuits and systems
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Proceedings Volume 1374, Integrated Optics and Optoelectronics II; (1991)
Event: SPIE Microelectronic Interconnect and Integrated Processing Symposium, 1990, San Jose, United States
Optical interconnections in the intrachip, chip-to-chip, and board-to-board scenarios are investigated. A universal polymer waveguide formation method is developed. Tunability from the step index to the graded index of the polymer film makes it possible to construct planar and channel waveguides on any substrate including semiconductors, conductors, and insulators. A polymer waveguide modulator based on a current injection method is further developed. Modulation depth as high as 36 dB is achieved with an injection density of 1.8 micro-A/sq micron. A microprism coupler (about 125 microns) with a coupling bandwidth higher than 200 nm is developed to solve the interface problems among different interconnection schemes. Using this concept, optical waves from a single-mode waveguide can be successfully coupled to a multimode fiber.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ray T. Chen "Optical interconnects: a solution to very high speed integrated circuits and systems", Proc. SPIE 1374, Integrated Optics and Optoelectronics II, (1 February 1991);


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