Paper
1 June 1991 Characterizing a surface imaging process in a high-volume DRAM manufacturing production line
Cesar M. Garza Sr., David L. Catlett Jr., Ricky A. Jackson
Author Affiliations +
Abstract
The manufacturing of the next generation of DRAMs will require microlithographic capability in the 0.5 micrometers range. Our goal is to develop this capability using g-line optical microlithography; and i- line when g-line fails. To determine if surface-imaging is a viable alternative to extend the practical resolution limit of g-line lithography in a manufacturing environment, we have set up and characterized DESIRE, a surface-imaging process, in a high-volume DRAM manufacturing production line. This characterization study includes: (a) determination of basic lithographic data, (b) measurement of linewidth as the criterion to determine the stability of the process over time, (c) pattern transfer and stability of the resist to dry-etch processes, (d) measurement of any radiation-induced damage taking place during dry- development.
© (1991) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Cesar M. Garza Sr., David L. Catlett Jr., and Ricky A. Jackson "Characterizing a surface imaging process in a high-volume DRAM manufacturing production line", Proc. SPIE 1466, Advances in Resist Technology and Processing VIII, (1 June 1991); https://doi.org/10.1117/12.46409
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Cited by 4 scholarly publications.
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KEYWORDS
Photoresist processing

Manufacturing

Lithography

Semiconducting wafers

Metals

Etching

Image processing

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