DSPI: a tool for analyzing thermal strain on ceramic and composite materials

Roland Hoefling; Petra Aswendt; Werner F. Totzauer; Werner P. O. Jueptner

doi:10.1117/12.47099

1 October 1991 DSPI: a tool for analyzing thermal strain on ceramic and composite materials

Roland Hoefling, Petra Aswendt, Werner F. Totzauer, Werner P. O. Jueptner

Proceedings Volume 1508, Industrial Applications of Holographic and Speckle Measuring Techniques; (1991) https://doi.org/10.1117/12.47099
Event: ECO4 (The Hague '91), 1991, The Hague, Netherlands

Abstract

This paper presents qualitative and quantitative results obtained from measurements on specimens of different composite materials and one ceramic-ceramic joint. Characterizing anisotropic material properties, extensive investigations have been carried out to measure effective thermal coefficients of expansion and to determine thermal shear based on correlation fringe patterns. Carbon-fiber materials reinforced with epoxy and metal matrix have been subjected to thermal cycles. A further DSPI application concerns residual stress analysis on a ceramic pipe that is laserbeam welded.

Citation Download Citation

Roland Hoefling, Petra Aswendt, Werner F. Totzauer, and Werner P. O. Jueptner "DSPI: a tool for analyzing thermal strain on ceramic and composite materials", Proc. SPIE 1508, Industrial Applications of Holographic and Speckle Measuring Techniques, (1 October 1991); https://doi.org/10.1117/12.47099

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