Vibration modal analysis using stroboscopic digital speckle pattern interferometry

Xizhou Wang; Yushan Tan

doi:10.1117/12.49540

1 December 1991 Vibration modal analysis using stroboscopic digital speckle pattern interferometry

Xizhou Wang, Yushan Tan

Proceedings Volume 1554, Second International Conference on Photomechanics and Speckle Metrology; (1991) https://doi.org/10.1117/12.49540
Event: San Diego, '91, 1991, San Diego, CA, United States

Abstract

Digital speckle pattern interferometry(DSPI) is a promising Optoelectronic testing technique for a wide range of applications. Comparing with holographic and speckle interferometry, it has some attractive features, such as needlessness of tedious film processing, high measuring accuracy, satisfactory automaticity. The measuring data can be displayed on the monitor at real time. In this paper, the vibration of a clamped steel plate is tested using stroboscopic Digital Speckle Pattern Interferometry. The advantages of stroboscopic technique are that it can give both the amplitude and phase information of a harmonic vibration . This is very useful for the vibration modal analysis of engineering structures. This work is realised on an image processing system based on IBM-PC/AT personal computer. The stroboscopic wavefronts are obtained by chopping a CW He-Ne laser using acousto-optic modulator. The fringe patterns obtained with stroboscopic DSPI are superior to that with time-averaging TV holography (ESPI or DPI). The interpretation of the stroboscopic DSPI fringes and selection of the system parameters are discussed in details. The Measured results are also given.

Citation Download Citation

Xizhou Wang and Yushan Tan "Vibration modal analysis using stroboscopic digital speckle pattern interferometry", Proc. SPIE 1554, Second International Conference on Photomechanics and Speckle Metrology, (1 December 1991); https://doi.org/10.1117/12.49540

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KEYWORDS

Fringe analysis

Interferometry

Speckle

Modal analysis

Pulsed laser operation

Speckle pattern

Birefringence

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