Diamond multichip modules

Tracy D. McSheery

doi:10.1117/12.2321734

1 December 1991 Diamond multichip modules

Tracy D. McSheery

Proceedings Volume 1563, Optical Enhancements to Computing Technology; (1991) https://doi.org/10.1117/12.2321734
Event: San Diego, '91, 1991, San Diego, CA, United States

Abstract

Diamond's thermal, mechanical, chemical, electrical and optical properties are ideally suited to the requirements of multichip modules. Gigahertz clock rates and increased device density are facilitated using diamond as a base material and as a hermetic passivation layer. Three dimensional architectures with optical communications would allow high speed communications for advanced designs in computers and rugged electronics. This paper provides an overview of potential applications and advantages of Diamond Multichip Modules.

Citation Download Citation

Tracy D. McSheery "Diamond multichip modules", Proc. SPIE 1563, Optical Enhancements to Computing Technology, (1 December 1991); https://doi.org/10.1117/12.2321734

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available