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1 December 1992 Hybrid packaging of surface-emitting microlaser arrays on planar optical systems
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Abstract
Microoptic technology offers a possibility to solve the problems that are associated with conventional opto-mechanics. These are large size, high cost, difficult alignment and sensitivity to mechanical and thermal influences. In order to overcome these problems, the concept of "planar optics" has been suggested where microoptic components are integrated on a single substrate using a two-dimensional layout. The integration of device chips on the optical component substrate is achieved by hybrid techniques such as flip-chip bonding. An array of gallium arsenide surface-emitting microlasers integrated with a planar optical imaging system is reported. We discuss fabrication issues concerning the bonding and applications of such a hybrid structure for free-space optical interconnects.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. Jahns "Hybrid packaging of surface-emitting microlaser arrays on planar optical systems", Proc. SPIE 1582, Integrated Optoelectronics for Communication and Processing, (1 December 1992); https://doi.org/10.1117/12.2321817
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