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The next generation sub-micron devices requires control of wafer environment and the interfaces between film layers. A wafer must not be exposed to atmosphere between some processing steps. To meet these requirements, multiple processing integrated system or "Cluster" tool for IC fabrication has been a major tooling development in the last few years. This leads to the concept of open architecture system and the development of interface standards. This also creates new demands on the system control and user interfaces. An open architecture integrated system must operate in a seamless fashion with real-time control and communication among the process modules and the wafer transport platform. Furthermore, it must present the user with a single interface mechanism with all the flexibility and functions required from the process modules as well as the wafer transport platform. The user interface will need to be configurable to die unique requirements of each process modules. In essence, the user should have all the flexibility in selecting their process module of choice without any penalty in performance. This paper describes the control and communication architecture and methods used in an open architecture cluster host platform. The architecture provides the basis of an environment that is easily adaptable to the various requirements in this type of tool. Functions such as flexible wafer routing, process recipe selection and editing, interface with multiple modules are shown. Other useful functions such as data logging, system performance record and "intelligent process parameter control" are also described. Finally, the authors will discuss developments directions that will provide complete and quick integration between the process modules and cluster host platform while still retaining the unique identity of each supplier in the future.
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