Advanced Via Inspection Tool

Douglas Y. Kim; Kurt Muller; Lawrence D. Thorp; Kenneth A. Bird

doi:10.1117/12.130305

1 August 1992 Advanced Via Inspection Tool

Douglas Y. Kim, Kurt Muller, Lawrence D. Thorp, Kenneth A. Bird

Proceedings Volume 1661, Machine Vision Applications in Character Recognition and Industrial Inspection; (1992) https://doi.org/10.1117/12.130305
Event: SPIE/IS&T 1992 Symposium on Electronic Imaging: Science and Technology, 1992, San Jose, CA, United States

Abstract

The AVIT inspects vias on unfired ceramic layers used in microelectronic packaging for paste fill depth spacing and size. Four shadow images from different angles and one vertical image determine the fill status of 100 89um vias in the area of 160mm by 160mm. Each via is filled with a conductive paste. The cycle time to inspect a greensheet is 3. 75 seconds. The paste depth is determined by the area of shadow given by each oblique direction. The greater area of shadow is used to determine via depth. In order to achieve the cycle time of 3. 75 seconds we incorporate a laser scanner rotating at 28 rpm telecentric scan lens and dedicated signal processing one of the electronic racks uses ECL running at 87 MHz. The other electronics are predominant Fast-TTL.

Citation Download Citation

Douglas Y. Kim, Kurt Muller, Lawrence D. Thorp, and Kenneth A. Bird "Advanced Via Inspection Tool", Proc. SPIE 1661, Machine Vision Applications in Character Recognition and Industrial Inspection, (1 August 1992); https://doi.org/10.1117/12.130305

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