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25 February 1993 Integrated test and package methods for integrated photonics
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Arrangements of discrete photonic waveguide devices are currently being integrated to form circuits. These Photonic Integrated Circuits (PICs) require test methods that are adaptable as circuit size and complexity grows. Here, we describe tests used to characterize a GaAs/GaAlAs waveguide-based PIC being developed for phase-shift control in phased-array antenna applications. The various elements of the PIC include digital and analog waveguide modulators, light-guide splitters and combiners, turning mirrors, and input-output polarization-maintaining single-mode optical fibers. These basic elements are combined to perform higher-order functions such as optical frequency translation (single side-band suppressed carrier modulation), and phase shifting on multiple optical taps. Tests used to characterize the elements include optical loss, guided-wave modal characteristic, antireflection coating effectiveness, electro-optical (phase) modulation efficiency, electrical frequency response, and optical frequency translation. These tests are integrated with the fiber attachment and RF packaging sequence to construct working device prototypes. They are currently being applied to discrete components of the circuit, and will be adapted as the various parts are integrated.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Richard Franklin Carson, Stanley H. Kravitz, Vincent M. Hietala, Nathan E. Harff, Marcelino G. Armendariz, and G. Allen Vawter "Integrated test and package methods for integrated photonics", Proc. SPIE 1791, Optical Materials Reliability and Testing: Benign and Adverse Environments, (25 February 1993);

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