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2 March 1993 Micromachined 50-um x 250-um silicon torsional mirror arrays for optical signal processing
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We propose an array of electrostatically driven torsional mirrors for optical signal processing. This 10-element device is 1-dimensional with pixels of 50 micrometers X 250 micrometers . The device is basically a hybrid integrated optical device which is fabricated in silicon and can be integrated with photodetectors and processing electronics to create elements of the so-called 'smart pixel' class of spatial light modulators. This class of devices will find application in many areas of optical processing including optical interconnects, optical switching, optical image analysis and optical neural networks. We discuss the design and fabrication of mirror arrays and electrode strips that are used to actuate them. The resonant frequency and deflection angle v.s. applied voltage of the fabricated devices are measured and compared with theoretical predictions.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Pin-Ju Hsiang, Augusto Garcia-Valenzuela, Mark Allen Neifeld, and Massood Tabib-Azar "Micromachined 50-um x 250-um silicon torsional mirror arrays for optical signal processing", Proc. SPIE 1793, Integrated Optics and Microstructures, (2 March 1993);


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