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14 January 1993 Improving built-in product reliability through the efficient identification of nonrandom contamination events
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Proceedings Volume 1802, Microelectronics Manufacturing and Reliability; (1993) https://doi.org/10.1117/12.139360
Event: Microelectronic Processing '92, 1992, San Jose, CA, United States
Abstract
Defects that occur during wafer manufacturing are the cause of extrinsic reliability failures. A major challenge of building-in product reliability is finding and eliminating the causes of defects as efficiently as possible. One approach to this problem is to use automatic patterned wafer inspection equipment to locate wafers in-process that have non-random patterns of defective die. Information leading to the identification of assignable causes of defects or contamination can be obtained by analyzing such wafers. A method for estimating the number of non-random defective die per wafer is described. The method is based on the failure of Poisson statistics to provide an accurate estimate of the observed visual yield if defects fall in systematic or clustered arrangements. An example is given in which this approach resulted in processing improvements that produced a two-fold reduction in product defect density during a ten week period.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Carl Aspin "Improving built-in product reliability through the efficient identification of nonrandom contamination events", Proc. SPIE 1802, Microelectronics Manufacturing and Reliability, (14 January 1993); https://doi.org/10.1117/12.139360
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