Chip-to-chip interconnects using poled polymer integrated optic transmitter networks

Timothy E. Van Eck; Dexter G. Girton; John Francis Valley; Susan P. Ermer; Anthony J. Ticknor; George F. Lipscomb; Richard S. Lytel

doi:10.1117/12.147114

1 July 1993 Chip-to-chip interconnects using poled polymer integrated optic transmitter networks

Timothy E. Van Eck, Dexter G. Girton, John Francis Valley, Susan P. Ermer, Anthony J. Ticknor, George F. Lipscomb, Richard S. Lytel

Author Affiliations +

Proceedings Volume 1849, Optoelectronic Interconnects; (1993) https://doi.org/10.1117/12.147114
Event: OE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering, 1993, Los Angeles, CA, United States

Abstract

An approach to optical interconnect networks at the module level is presented that addresses the requirements imposed by electronic system manufacturing, such as thermal stability, low cost, and compatibility with standard electronic design, fabrication, and assembly processes. Research is presented on poled polyimide electro-optic materials with extended thermal stability, poled polyimide integrated optic switches acting as transmitters, and a demonstration of a CMOS-compatible optical interconnect.

Citation Download Citation

Timothy E. Van Eck, Dexter G. Girton, John Francis Valley, Susan P. Ermer, Anthony J. Ticknor, George F. Lipscomb, and Richard S. Lytel "Chip-to-chip interconnects using poled polymer integrated optic transmitter networks", Proc. SPIE 1849, Optoelectronic Interconnects, (1 July 1993); https://doi.org/10.1117/12.147114

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