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1 July 1993 Optical waveguide interconnections for optoelectronic multichip modules
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Proceedings Volume 1849, Optoelectronic Interconnects; (1993)
Event: OE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering, 1993, Los Angeles, CA, United States
New packaging techniques for opto-electronic multichip modules (OE-MCMs), including OE substrates and optical coupling between a waveguide and a flip-chip bonded photodevice or fiber, are presented for high-speed and wide-band communication systems. The OE substrates, which offer high-density, high-speed optical and electrical interconnection, are made from low loss (0.4 dB/cm) optical polyimide waveguides fabricated on copper-polyimide electrical multilayer substrates. A total internal reflection mirror fabricated at the edge of the optical waveguide reflects the light propagating from the waveguide to a flip-chip bonded photodiode with a loss of less than 1.5 dB. The waveguides are coupled to fibers for inter-module interconnection using the self-aligning fiber guiding method.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hideyuki Takahara, Shinji Koike, Satoru Yamaguchi, and Hisashi Tomimuro "Optical waveguide interconnections for optoelectronic multichip modules", Proc. SPIE 1849, Optoelectronic Interconnects, (1 July 1993);

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