Prototype optically interconnected multichip module based on computer-generated hologram technology

James E. Morris; Michael R. Feldman; W. Hudson Welch; Mouna Nakkar; Hedong Yang; John E. Childers; M. Yasin Akhtar Raja; Iwona Turlik; Gretchen M. Adema; Paul A. Magill; Ed Yung

doi:10.1117/12.147078

1 July 1993 Prototype optically interconnected multichip module based on computer-generated hologram technology

James E. Morris, Michael R. Feldman, W. Hudson Welch, Mouna Nakkar, Hedong Yang, John E. Childers, M. Yasin Akhtar Raja, Iwona Turlik, Gretchen M. Adema, Paul A. Magill, Ed Yung

Author Affiliations +

Proceedings Volume 1849, Optoelectronic Interconnects; (1993) https://doi.org/10.1117/12.147078
Event: OE/LASE'93: Optics, Electro-Optics, and Laser Applications in Scienceand Engineering, 1993, Los Angeles, CA, United States

Abstract

The development of an optical interconnected multichip module (MCM) is underway at UNC- Charlotte. The approach is to use optical interconnects within a digital multichip module for connections that are longer than a certain length (break even line length). For these connections the optical link dissipates less power than the corresponding electrical link. One of the main goals of this project is to develop a technology for optical interconnects that can be implemented with minimal modification to current devices. We are currently in the process of developing a series of MCM systems. System 1 will be a testbed that enables testing of hologram encoding techniques, alignment tolerances, optical link efficiency, and thermal properties. System 2 will use the knowledge gained in the development of system 1 to build a small functional system to demonstrate the technology.

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James E. Morris, Michael R. Feldman, W. Hudson Welch, Mouna Nakkar, Hedong Yang, John E. Childers, M. Yasin Akhtar Raja, Iwona Turlik, Gretchen M. Adema, Paul A. Magill, and Ed Yung "Prototype optically interconnected multichip module based on computer-generated hologram technology", Proc. SPIE 1849, Optoelectronic Interconnects, (1 July 1993); https://doi.org/10.1117/12.147078

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