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6 May 1993 Automated direct patterned-wafer inspection
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Proceedings Volume 1907, Machine Vision Applications in Industrial Inspection; (1993) https://doi.org/10.1117/12.144805
Event: IS&T/SPIE's Symposium on Electronic Imaging: Science and Technology, 1993, San Jose, CA, United States
Abstract
A self-reference technique is developed for detecting the location of defects in repeated pattern wafers and masks. The application area of the proposed method includes inspection of memory chips, shift registers, switch capacitors, CCD arrays, and liquid crystal displays (LCD). Using high resolution spectral estimation algorithms, the proposed technique first extracts the period and structure of repeated patterns from the image to sub-pixel resolution, and then produces a defect-free reference image for making comparison with the actual image. Since the technique acquires all its needed information from a single image, there is no need for a database image, a scaling procedure, or any a-priori knowledge about the repetition period of the patterns. Results of applying the proposed technique to real images from microlithography are presented.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Babak H. Khalaj, Hamid K. Aghajan, and Thomas Kailath "Automated direct patterned-wafer inspection", Proc. SPIE 1907, Machine Vision Applications in Industrial Inspection, (6 May 1993); https://doi.org/10.1117/12.144805
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