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6 May 1993 Prototype model for automatic IC bonding inspection
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Proceedings Volume 1907, Machine Vision Applications in Industrial Inspection; (1993)
Event: IS&T/SPIE's Symposium on Electronic Imaging: Science and Technology, 1993, San Jose, CA, United States
Third Internal Visual Inspection in the IC assembly process deals with the wire bond quality inspection and is a very labor intensive stage. This paper describes a simple but comprehensive prototype model developed to automate the inspection of wedge and ball bonds. It is assumed that the die tilt is within specifications and the bond pad is automatically aligned. The defects associated with the bond quality are classified into four categories: size, shape, position and dimension. The bond is inspected sequentially for each category of defects and is rejected without further processing when any defect is detected. The procedure adopted in the prototype is as follows: A global thresholding technique automatically binarizes the intensity image of the bond. Bond limits are determined by a scanning procedure. Simple techniques such as pixel count, MER, Centroid and Median are used to verify the specifications related to size and shape. An intelligent scanning technique inspects the position related specifications in addition to identifying the wire and tail positions of the bond. The dimensions of the bond are determined by using projection information. 100% success is achieved with the experiments conducted using 100 sample images.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mandava Rajeswari, K. Saravanan, and P. Krishnasamy "Prototype model for automatic IC bonding inspection", Proc. SPIE 1907, Machine Vision Applications in Industrial Inspection, (6 May 1993);

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