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6 May 1993 Specifications for the development of a 3D visual inspection/diagnosis system for damaged VLSI boards: VLSI reverse engineering
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Proceedings Volume 1907, Machine Vision Applications in Industrial Inspection; (1993) https://doi.org/10.1117/12.144801
Event: IS&T/SPIE's Symposium on Electronic Imaging: Science and Technology, 1993, San Jose, CA, United States
Abstract
The automatic, real-time visual acquisition and inspection of VLSI boards requires the use of machine vision and artificial intelligence methodologies in a new "frame" for the achievement of better results regarding efficiency, quality and automated service. Thus, the development of a knowledge base for automated inspection and acquisition of VLSI boards becomes an important issue with today's needs from the electronic marketing. Inthis paper we describe the visual inspection of damaged VLSI boards and discuss the specifications for the development of a knowledge base associated with the visual inspection.
© (1993) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ali Moghaddamzadeh and Nikolaos G. Bourbakis "Specifications for the development of a 3D visual inspection/diagnosis system for damaged VLSI boards: VLSI reverse engineering", Proc. SPIE 1907, Machine Vision Applications in Industrial Inspection, (6 May 1993); https://doi.org/10.1117/12.144801
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