In-situ sensory technique for in-service quality monitoring: measurement of the complex Young's modulus of polymers

Shunhua Zhou; Chen Liang; Craig A. Rogers; Fanping P. Sun; L. Vick

doi:10.1117/12.147972

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12 July 1993 In-situ sensory technique for in-service quality monitoring: measurement of the complex Young's modulus of polymers

Shunhua Zhou, Chen Liang, Craig A. Rogers, Fanping P. Sun, L. Vick

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Proceedings Volume 1918, Smart Structures and Materials 1993: Smart Sensing, Processing, and Instrumentation; (1993) https://doi.org/10.1117/12.147972
Event: 1993 North American Conference on Smart Structures and Materials, 1993, Albuquerque, NM, United States

Abstract

Applications of polymeric adhesives in joining different materials have necessitated quantitative health inspection of adhesive joints (coverage, state of cure, adhesive strength, location of voids, etc.). A new in-situ sensory method has been proposed in this paper to inspect the amount and distribution of the critical constituents of polymers and to measure the characteristic parameters (complex Young's modulus and damping). In this technique, ferromagnetic particles have been embedded in a polymeric matrix, similar to a particle- reinforced composite. The dynamic signatures extracted from the tests as a result of magnetic excitation of the embedded ferromagnetic particles are used to evaluate the complex Young's modulus of the host polymers. Moreover, the amplitude of the frequency response is utilized to identify the amount and distribution of embedded particles in polymeric materials or adhesive joints. The results predicted from the theoretical model agree well with the experimental results. The theoretical analyses and the experimental work conducted have demonstrated the utility of the sensory technique presented for in-service health interrogation.

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Shunhua Zhou, Chen Liang, Craig A. Rogers, Fanping P. Sun, and L. Vick "In-situ sensory technique for in-service quality monitoring: measurement of the complex Young's modulus of polymers", Proc. SPIE 1918, Smart Structures and Materials 1993: Smart Sensing, Processing, and Instrumentation, (12 July 1993); https://doi.org/10.1117/12.147972

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