Surface deformation, recorded by the holographic interferometry, used as an interface between the modeling and the experiment in the field of overlap adhesive bonds

Thomas Bischof; Werner P. O. Jueptner

doi:10.1117/12.158604

27 September 1993 Surface deformation, recorded by the holographic interferometry, used as an interface between the modeling and the experiment in the field of overlap adhesive bonds

Thomas Bischof, Werner P. O. Jueptner

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Proceedings Volume 1999, Adhesives Engineering; (1993) https://doi.org/10.1117/12.158604
Event: SPIE's 1993 International Symposium on Optics, Imaging, and Instrumentation, 1993, San Diego, CA, United States

Abstract

The holographic interferometry is a tool, to detect the displacement on the surface of a specimen, with an accuracy of less than the wavelength of the used laser. The Finite-Element- Method can be used, for instance to model problems of the structural mechanics. To verify the model with the behavior of the real specimen, there must be an interface. Two investigations were done on overlap-adhesive-bonds. First the inhomogeneous surface displacement over an adhesive defect under thermal load could be explained and second the material properties of the adhesive-layer could be determined, both with the surface deformation as interface between model and experiment.

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Thomas Bischof and Werner P. O. Jueptner "Surface deformation, recorded by the holographic interferometry, used as an interface between the modeling and the experiment in the field of overlap adhesive bonds", Proc. SPIE 1999, Adhesives Engineering, (27 September 1993); https://doi.org/10.1117/12.158604

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