Open Access Paper
15 February 1994 Cost of ownership for soft x-ray projection lithography
Kathleen Early, William H. Arnold
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Abstract
We present a general analysis of cost of ownership for an integrated circuit production lithography system. We illustrate the method with examples from i-line and deep ultraviolet lithography, as well as soft x-ray projection lithography. Tool utilization is emphasized as well as system throughput. Our analysis suggests that with 20 wafer per hour throughput, which may be attainable with soft x-ray projection lithography, lithography costs will rise to four times today's i-line costs, or higher. In addition to throughput, reticles and photoresist will be cost drivers for this technology.
© (1994) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kathleen Early and William H. Arnold "Cost of ownership for soft x-ray projection lithography", Proc. SPIE 2087, 13th Annual BACUS Symposium on Photomask Technology and Management, (15 February 1994); https://doi.org/10.1117/12.167276
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CITATIONS
Cited by 3 scholarly publications.
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KEYWORDS
Semiconducting wafers

Reticles

Lithography

Deep ultraviolet

Projection lithography

X-rays

Photomask technology

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